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Upcoming Intel Alder Lake-S desktop processors will require new heat absorbers

With 12th Generation Intel Core Desktop Processors 12th Generation Alder Lake-S, a new LGA1700 socket will also arrive at the end of the year. IGorsLab has posted some …





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With 12th Generation Intel Core Desktop Processors 12th Generation Alder Lake-S, a new LGA1700 socket will also arrive at the end of the year. IGorsLab Web Post some parameters and drawings which clearly show that the current chillers will not be compatible.

Intel is preparing three main lines of 12th generation processors. Alder Lake Chips will have a lot of hybrid variants

The main difference for the new generation of processors will be that it will not be square, but rather rectangular. The holes around the socket will be completely different, as well as distributing the chips under the processor heat sink.

The base itself will also differ from the current one in that it will be about a millimeter thinner, which means pressure and differently-tuned values ​​according to the radiator manufacturer’s Intel specifications.

The images also show the basic graphics of the packed cooler, which will likely be supplied only for the more economical models up to TDP 65 W which will also not be backward compatible.

Intel must also provide the pre-inserted heatsink with the built-in Peltier article (Cooler Master MasterL Liquid ML360 Sub-Zero), is able to reduce the processor temperature to zero, even at the cost of consumption similar to that of the processor itself. Thanks to this, overclockers will be able to achieve very high frequencies.

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The LGA1700 socket should also house the next generation Raptor Lake-S (thirteenth generation Intel Core) processors.

How is the 11th Generation Intel Core Made

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